Modeling

• Sensor design involves creating models to test, which requires significant analytical teamwork. This phase utilities modeling programs for 3D bio-inspired MEMS microsensors. Software tools (ANSYS, WYKO, Finite Element, MatLab, LEdit, COMSOL) enable us to model concepts and easily create mask designs.

Design

• The design component of our laboratory is rooted in on our patented sensor technology and has become nearly automated with the use of software programs. The design phase is a dynamic process that relies on team members all along the development chain. The strong interdependence of the mechanical and electronic design, materials processing and packaging components is most evident at this important stage.
• As new materials and applications for sensor technologies emerge, we continue to explore new opportunities and push the boundaries of what is possible.

Fabrication

• Fabrication activities include analysis and modeling as well as the manufacturing & packaging of 3D bio-inspired MEMS micro-sensors. Our team models and fabricates micro-fluidic channels, carbon nanotubes, and organic flexible electronics to name a few.
• Our fabrication team includes the most experienced and prolific user of the Cornell’s NanoScale Science and Technology Facility (CNF), Mr. S.A. Jones. He is trained on 80% of the 57 tools (www.cnf.cornell.edu/cnf5_tool.taf) that CNF houses and is an expert process engineer for MEMS and NEMS designs in 3D. He is also fully trained in the Cornell Nano Biotechnology Center, along with their process capabilities.
  (www.nbtc.cornell.edu/facilities/tool_status.htm)

Acoustic Testing and Analysis
Our acoustic testing and analysis team focuses on acoustic and vibration measurements and characterizations of silicon acoustic microsensors and structures. This critical activity in the lab includes:

• Measurement and predictions of acoustic responses and noise floors of prototypes and the effects of electrostatic forces on microstructures
• Signal processing and controls; modal analysis; parameter estimation; test fixture design and fabrication; automated data acquisition programming; and structural failure and defect analysis on silicon microdevices